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                                TQF7059
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                                                                    RF Front End

Qorvo TQF7059

Manufacturer:

Qorvo

Mfr.Part #:

TQF7059

Package:

RoHS:
Datasheet:

TQF7059

Description:

RF Front End 5GHz WLAN FEM 802.11a/n/ac FEM

ECAD Model:
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Product Technical Specifications

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Manufacturer Qorvo
Product Category RF Front End
RoHS
Type 802.11 a/n/ac WLAN
Maximum Data Rate -
Operating Frequency 4.9 GHz to 5.925 GHz
Mounting Style SMD/SMT
Product Type RF Front End
Package / Case QFN-16
Minimum Operating Temperature - 30 C
Maximum Operating Temperature + 85 C
Operating Supply Current 300 mA
Operating Supply Voltage 3.3 V to 5 V
NF - Noise Figure 2.1 dB, 4 dB
Gain 13 dB, 31 dB
Packaging Cut Tape or Reel
Part # Aliases 1121720
Brand Qorvo
Development Kit TQF7059-PCB
Technology Silicon
Subcategory Wireless & RF Integrated Circuits

Product Details

TQF7059   TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 1 of 7 www.qorvo.com 16 Pad 3 x 3 x 0.85 mm QFN Package Product Features  Fully Integrated, 802.11a / n / ac Front-end Module  Internally Matched Input / Output  Integrated Power Detector  Temperature Compensated Bias Network  Typ. Pout=+21.5 dBm at EVM=1.8% (−35 dB) 802.11ac / MCS9 / VHT80 (+5 V)  Typ. Pout=+23 dBm at EVM=3.0 % (−30 dB) 802.11n / MCS7 / HT40 (+5 V)  Supply Voltage +3.3 V to +5 V  Leadless 3 x 3 x 0.85 mm QFN Package  Lead Free, RoHS Compliant General Description The TQF7059 is a fully integrated WLAN front-end module (FEM) designed for 802.11ac applications. The TQF7059 contains a 5 GHz power amplifier, a power detector, a front-end SPDT switch, and an LNA with bypass mode. The architecture and interface are optimized to provide outstanding stable performance across temperature and voltage range for next generation, high throughput 802.11ac WLAN applications. The TQF7059 FEM features CMOS compatible control voltages to facilitate ease of use. With its integrated compact design, the TQF7059 minimizes radio footprint and component count while achieving industry leading output power and EVM rivaling complex discrete high power designs. The TQF7059 is assembled in a Pb-Free, thin profile, 16 pad, 3 mm x 3 mm x 0.85 mm QFN package. Functional Block Diagram Ordering Information Part No. Description TQF7059 2500 Pieces on a 7” reel (standard) TQF7059-PCB Assembled Evaluation Board Applications  802.11a / n / ac Wireless LAN Systems  CPE (Set Top Box, routers, gateways)  WiFi Access Points and Small Cells  Telematics  Gaming and Infotainment  ISM applications 5 – 6 GHz   TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 2 of 7 www.qorvo.com Absolute Maximum Ratings Parameter Rating Storage Temperature −40 to +150 °C RF Input Power, CW, 50Ω, T=25 °C +5 dBm Case Temperature Survival −40 to +100 °C Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units VDD1, VDD2 , V DD3 +3.15 +5.0 +5.25 V TAMB −30 25 +85 °C Tj (for > 10 6 hours MTTF) 170 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications − Overall Module Parameter Conditions (1) Min Typ Max Units Quiescent Current Pout = −10 dBm, 11ac, MCS9, HT80 180 mA Operating Current Pout = +20.5 dBm,11ac, MCS9, HT80 300 mA PA Enable Control Voltage, V IH Input Voltage for High State +1.8 +3.0 VDD1 V PA Enable Control Voltage, V IL Input Voltage for Low State 0 +0.45 V Control Current, I IH 100 μA TX Shutdown Current 8 μA TX Turn on/off time 10 – 90% <0.4 μs TX Rise/Fall time 10 – 90% <0.4 μs Thermal Resistance, θ jc Junction to backside paddle 27 °C/W Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3 =+5.0 V, Temp=+25°C. Logic Truth Table 5 GHz FEM PA_EN LNA_EN CRX Shutdown 0 0 0 Rx - Bypass Mode 0 0 1 RX- Normal Mode 0 1 1 TX Mode 1 0 0 TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 3 of 7 www.qorvo.com Electrical Specifications – Transmit (Tx) Parameter Conditions Min Typ Max Units Operational Freq. Range 4900 5925 MHz TX Gain Small Signal 31 dB Pout =+21dBm 31 dB Small Signal TX Gain Out of Band 1600 – 1960 MHz −35 dB 3200 – 3900 MHz 2 7000 MHz 20 PA Noise Figure Noise Figure 4 dB TX Harmonics (2fo) Pout = +25 dBm, 11a, 6 Mbps, 20 MHz −33 dBm/MHz TX Harmonics (3fo) Pout = +25 dBm, 11a, 6 Mbps, 20 MHz −37 dBm/MHz ANT-RX Isolation When TX is ON 45 dB Spectral Emission Mask Margin Relative to 11ac standard 11ac, MCS0, HT20 Pout = +25 dBm 3.6 dB DEVM (11n / MCS7 / HT40) Pout = +23 dBm, 5150 – 5850 MHz −30 dB DEVM (11ac / MCS9 / VHT80) Pout = +16 dBm, 5150 – 5850 MHz −37 dB DEVM (11ac / MCS9 / VHT80) Pout = +20.5 dBm, 5150 – 5850 MHz −36 dB Quiescent Current No RF 180 mA Operating Current Pout = +20.5 d Bm,11ac, MCS9, VHT80 300 mA Detector Voltage No RF 0.35 V Pout = +25 dBm 1.0 Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3=+5.0 V, Temp.=+25 °C, −45 dB EVM source, TQF7059-PCB Electrical Specifications – Receive (Rx) Parameter Conditions Min Typ Max Units Operating Frequency 4900 5925 MHz RX Gain – Normal Mode ANT to RX out 13 dB RX Gain – Bypass Mode ANT to RX out −7 dB RX Flatness Over entire, ANT to RX out −1 1 RX Noise Figure Normal mode, ANT to RX out 2.1 dB LNA Current 9 mA IIP3 – Normal Mode At ANT port through LNA +4.0 dBm IIP3 – Bypass Mode At ANT port through LNA +23 dBm RX Output Return Loss RX output in RX mode 10 dB RX ANT Port Return Loss ANT port in RX mode 7 dB RX Output Return Loss RX output in Bypass mode 12 dB RX ANT Port Return Loss ANT port in Bypass mode 7 dB Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3 =+5.0 V, Temp.=+25 °C, TQF7059-PCB TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 4 of 7 www.qorvo.com Application Circuit - TQF7059-PCB Bill of Material - TQF7059-PCB Ref Des Value Description Manuf. Part Number n/a n/a Printed Circuit Board U1 n/a High Power WLAN 5GHz FEM Qorvo TQF7059 C1, C5 2.2 uF Capacitor, Chip, 0402, 5% various C2, C3, C4 0.1 uF Capacitor, Chip, 0201, 5% various Evaluation Board PCB Information ROGERS 4003 .012 ± 0.001 inch. Layer for mechanical rigidity of PCB Top Layer 1.5 oz. Cu Middle Layer 1.5 oz. Cu Bottom Layer 1.5 oz. Cu Overall Board Thickness .047 ± 0.005 inch. TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 5 of 7 www.qorvo.com Pin Configuration and Description Top View Pad No. Label Description 1 GND Ground 2 Rx Rx output, DC blocked RF I/O 3 GND No internal connection. Recommended grounding this pin. 4 VDD1 Supply pin for LNA, Logic & Bias circuits. 5 VDET Detector output voltage for 5 GHz PA 6 PA_EN PA Enable 7 GND No internal connection. Recommended grounding this pin. 8 Tx 5 GHz Tx PA input, DC blocked RF I/O 9 NC No internal connection. Recommended grounding this pin. 10 VDD2 Supply pin for PA 1 st and 2 nd stage. 11 VDD3 Supply pin for PA final stage. 12 GND No internal connection. Recommended grounding this pin. 13 ANT Antenna pin, DC blocked RF I/O 14 GND No internal connection. Recommended grounding this pin. 15 CRX Control pin. Refer to logic truth table on pg. 2 16 LNA_EN LNA Enable Backside Pad RF/DC GND RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint. TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 6 of 7 www.qorvo.com Package Marking and Dimensions Marking: Product Identifier –“7059” Date Code – YYWW Lot Code – aXXXX Top View Bottom View Side View Notes: 1. All dimensions are in millimeters. Angles are in degrees. PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 0.850±0.050 3.000±0.050 BY MARKING PIN 1 DOT 3.000±0.050 0.203 Ref. 0.000-0.050 PIN #1 IDENTIFICATION CHAMFER 0.300X45° 1.700±0.050 Exp. DAP 1.700±0.050 Exp. DAP 0.500 Bsc 0.250±0.050 0.300±0.050 Pin 1 Locator COMPONENT SIDE7X3 16X 0.32 0.50 Pitch 16X 16X 0.52 1.50 1.50 Package Outline 0.31 0.09 0.55 0.32 0.64 7059 YYWW aXXXX TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 7 of 7 www.qorvo.com Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1B ESDA / JEDEC JS-001-2012 ESD – Charged Device Model (CDM) Class C3 JEDEC JESD22-C101F MSL – Moisture Sensitivity Level Level 1 IPC/JEDEC J-STD-020 Solderability Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes. Solder profiles available upon request. Contact plating: NiPdAu RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes:  Lead Free  Halogen Free (Chlorine, Bromine)  Antimony Free  TBBP-A (C 15H12Br402) Free  PFOS Free  SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders fo r Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2016 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. chipmall Electronics Qorvo:   TQF7059 TQF7059
TQF7059   TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 1 of 7 www.qorvo.com 16 Pad 3 x 3 x 0.85 mm QFN Package Product Features  Fully Integrated, 802.11a / n / ac Front-end Module  Internally Matched Input / Output  Integrated Power Detector  Temperature Compensated Bias Network  Typ. Pout=+21.5 dBm at EVM=1.8% (−35 dB) 802.11ac / MCS9 / VHT80 (+5 V)  Typ. Pout=+23 dBm at EVM=3.0 % (−30 dB) 802.11n / MCS7 / HT40 (+5 V)  Supply Voltage +3.3 V to +5 V  Leadless 3 x 3 x 0.85 mm QFN Package  Lead Free, RoHS Compliant General Description The TQF7059 is a fully integrated WLAN front-end module (FEM) designed for 802.11ac applications. The TQF7059 contains a 5 GHz power amplifier, a power detector, a front-end SPDT switch, and an LNA with bypass mode. The architecture and interface are optimized to provide outstanding stable performance across temperature and voltage range for next generation, high throughput 802.11ac WLAN applications. The TQF7059 FEM features CMOS compatible control voltages to facilitate ease of use. With its integrated compact design, the TQF7059 minimizes radio footprint and component count while achieving industry leading output power and EVM rivaling complex discrete high power designs. The TQF7059 is assembled in a Pb-Free, thin profile, 16 pad, 3 mm x 3 mm x 0.85 mm QFN package. Functional Block Diagram Ordering Information Part No. Description TQF7059 2500 Pieces on a 7” reel (standard) TQF7059-PCB Assembled Evaluation Board Applications  802.11a / n / ac Wireless LAN Systems  CPE (Set Top Box, routers, gateways)  WiFi Access Points and Small Cells  Telematics  Gaming and Infotainment  ISM applications 5 – 6 GHz   TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 2 of 7 www.qorvo.com Absolute Maximum Ratings Parameter Rating Storage Temperature −40 to +150 °C RF Input Power, CW, 50Ω, T=25 °C +5 dBm Case Temperature Survival −40 to +100 °C Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units VDD1, VDD2 , V DD3 +3.15 +5.0 +5.25 V TAMB −30 25 +85 °C Tj (for > 10 6 hours MTTF) 170 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications − Overall Module Parameter Conditions (1) Min Typ Max Units Quiescent Current Pout = −10 dBm, 11ac, MCS9, HT80 180 mA Operating Current Pout = +20.5 dBm,11ac, MCS9, HT80 300 mA PA Enable Control Voltage, V IH Input Voltage for High State +1.8 +3.0 VDD1 V PA Enable Control Voltage, V IL Input Voltage for Low State 0 +0.45 V Control Current, I IH 100 μA TX Shutdown Current 8 μA TX Turn on/off time 10 – 90% <0.4 μs TX Rise/Fall time 10 – 90% <0.4 μs Thermal Resistance, θ jc Junction to backside paddle 27 °C/W Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3 =+5.0 V, Temp=+25°C. Logic Truth Table 5 GHz FEM PA_EN LNA_EN CRX Shutdown 0 0 0 Rx - Bypass Mode 0 0 1 RX- Normal Mode 0 1 1 TX Mode 1 0 0 TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 3 of 7 www.qorvo.com Electrical Specifications – Transmit (Tx) Parameter Conditions Min Typ Max Units Operational Freq. Range 4900 5925 MHz TX Gain Small Signal 31 dB Pout =+21dBm 31 dB Small Signal TX Gain Out of Band 1600 – 1960 MHz −35 dB 3200 – 3900 MHz 2 7000 MHz 20 PA Noise Figure Noise Figure 4 dB TX Harmonics (2fo) Pout = +25 dBm, 11a, 6 Mbps, 20 MHz −33 dBm/MHz TX Harmonics (3fo) Pout = +25 dBm, 11a, 6 Mbps, 20 MHz −37 dBm/MHz ANT-RX Isolation When TX is ON 45 dB Spectral Emission Mask Margin Relative to 11ac standard 11ac, MCS0, HT20 Pout = +25 dBm 3.6 dB DEVM (11n / MCS7 / HT40) Pout = +23 dBm, 5150 – 5850 MHz −30 dB DEVM (11ac / MCS9 / VHT80) Pout = +16 dBm, 5150 – 5850 MHz −37 dB DEVM (11ac / MCS9 / VHT80) Pout = +20.5 dBm, 5150 – 5850 MHz −36 dB Quiescent Current No RF 180 mA Operating Current Pout = +20.5 d Bm,11ac, MCS9, VHT80 300 mA Detector Voltage No RF 0.35 V Pout = +25 dBm 1.0 Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3=+5.0 V, Temp.=+25 °C, −45 dB EVM source, TQF7059-PCB Electrical Specifications – Receive (Rx) Parameter Conditions Min Typ Max Units Operating Frequency 4900 5925 MHz RX Gain – Normal Mode ANT to RX out 13 dB RX Gain – Bypass Mode ANT to RX out −7 dB RX Flatness Over entire, ANT to RX out −1 1 RX Noise Figure Normal mode, ANT to RX out 2.1 dB LNA Current 9 mA IIP3 – Normal Mode At ANT port through LNA +4.0 dBm IIP3 – Bypass Mode At ANT port through LNA +23 dBm RX Output Return Loss RX output in RX mode 10 dB RX ANT Port Return Loss ANT port in RX mode 7 dB RX Output Return Loss RX output in Bypass mode 12 dB RX ANT Port Return Loss ANT port in Bypass mode 7 dB Notes: 1. Test conditions unless otherwise noted: V DD1, VDD2 , VDD3 =+5.0 V, Temp.=+25 °C, TQF7059-PCB TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 4 of 7 www.qorvo.com Application Circuit - TQF7059-PCB Bill of Material - TQF7059-PCB Ref Des Value Description Manuf. Part Number n/a n/a Printed Circuit Board U1 n/a High Power WLAN 5GHz FEM Qorvo TQF7059 C1, C5 2.2 uF Capacitor, Chip, 0402, 5% various C2, C3, C4 0.1 uF Capacitor, Chip, 0201, 5% various Evaluation Board PCB Information ROGERS 4003 .012 ± 0.001 inch. Layer for mechanical rigidity of PCB Top Layer 1.5 oz. Cu Middle Layer 1.5 oz. Cu Bottom Layer 1.5 oz. Cu Overall Board Thickness .047 ± 0.005 inch. TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 5 of 7 www.qorvo.com Pin Configuration and Description Top View Pad No. Label Description 1 GND Ground 2 Rx Rx output, DC blocked RF I/O 3 GND No internal connection. Recommended grounding this pin. 4 VDD1 Supply pin for LNA, Logic & Bias circuits. 5 VDET Detector output voltage for 5 GHz PA 6 PA_EN PA Enable 7 GND No internal connection. Recommended grounding this pin. 8 Tx 5 GHz Tx PA input, DC blocked RF I/O 9 NC No internal connection. Recommended grounding this pin. 10 VDD2 Supply pin for PA 1 st and 2 nd stage. 11 VDD3 Supply pin for PA final stage. 12 GND No internal connection. Recommended grounding this pin. 13 ANT Antenna pin, DC blocked RF I/O 14 GND No internal connection. Recommended grounding this pin. 15 CRX Control pin. Refer to logic truth table on pg. 2 16 LNA_EN LNA Enable Backside Pad RF/DC GND RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint. TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 6 of 7 www.qorvo.com Package Marking and Dimensions Marking: Product Identifier –“7059” Date Code – YYWW Lot Code – aXXXX Top View Bottom View Side View Notes: 1. All dimensions are in millimeters. Angles are in degrees. PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 0.850±0.050 3.000±0.050 BY MARKING PIN 1 DOT 3.000±0.050 0.203 Ref. 0.000-0.050 PIN #1 IDENTIFICATION CHAMFER 0.300X45° 1.700±0.050 Exp. DAP 1.700±0.050 Exp. DAP 0.500 Bsc 0.250±0.050 0.300±0.050 Pin 1 Locator COMPONENT SIDE7X3 16X 0.32 0.50 Pitch 16X 16X 0.52 1.50 1.50 Package Outline 0.31 0.09 0.55 0.32 0.64 7059 YYWW aXXXX TQF7059 5 GHz WLAN Front End Module Data Sheet, July 30, 2016 | Subject to change without notice 7 of 7 www.qorvo.com Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1B ESDA / JEDEC JS-001-2012 ESD – Charged Device Model (CDM) Class C3 JEDEC JESD22-C101F MSL – Moisture Sensitivity Level Level 1 IPC/JEDEC J-STD-020 Solderability Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes. Solder profiles available upon request. Contact plating: NiPdAu RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes:  Lead Free  Halogen Free (Chlorine, Bromine)  Antimony Free  TBBP-A (C 15H12Br402) Free  PFOS Free  SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders fo r Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2016 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. chipmall Electronics Qorvo:   TQF7059 TQF7059
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,,Qorvo,RF Front End,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,802.11 a/n/ac WLAN,,,4.9 GHz to 5.925 GHz,,RF Front End,QFN-16,- 30 C,,,300 mA,3.3 V to 5 V,2.1 dB, 4 dB,13 dB, 31 dB,,,1121720,,,Silicon,Wireless & RF Integrated Circuits,,,
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