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Elensi Ti60 FPGA in TSMC 16 nanometer process node flow chip

souhu | XILINX | 20/01/2021

Elensi Ti60 FPGA in TSMC 16 nanometer process node flow chip

 

Programmable product platform and technology innovator Elensi ® has announced that its Ti60 FPGA has been installed on TSMC's 16-nanometer process node wafer. This device is the first product in the Trion® Titanium series that USES Quantum™ computing architecture for enhanced computing and acceleration capabilities. Compared to the Trion series of the previous generation, Titanium works at three times the frequency and is only 1/4 the size of the wafer. With Titanium series in the visual system of artificial intelligence and based on the data center to the edge of the equipment on the proximal data processing functions such as application of an ideal choice
 
 
"The Titanium series opens a new era for Elings FPgas," says Ming Ng, senior vice President of operations and applications at Elings. With enhanced computing power, faster speeds and slimmer sizes, they will set a new price/performance basis for embedded computing. The low power consumption of Titanium devices makes it ideal for edge and proximal data processing applications, where unmanageable, demanding environments are common.
 
According to the "Easy-to-build Acceleration platform" innovative solution, Ti60 will soon be available to customers in the form of bare chips, authorized IP cores, and traditional packaged FPGas. The "easy to construct" solution enables elenesis FPGA technology to provide multiple encapsulation options at any time, thus promoting the development of system-level encapsulation (SiP) and highly integrated applications. In addition, E-Construct provides a series of software packages that enable the product to be quickly launched by embedding various accelerators based on risC-V processor cores in E-Construct devices.
 
Jing Kuo, China General Manager and Vice President of sales and Business Development, Said: "Looking ahead, due to power consumption and cost, traditional packaged FPgas are no longer able to meet the needs of many markets such as wireless communications infrastructure and high-capacity dedicated standard Devices (ASSP). We need something more versatile, and by adding Titanium to our revolutionary "Easier-To-make" proposition, we'll be able to provide Quantum technology with embedded RISC-V kernel power to these markets. This will unlock the tremendous potential of FPGA to rapidly bring embedded solutions and proprietary standard devices (ASSP) based on applications such as proximal data processing and heterogeneous computing to market.
 
Elensi's cooperation with TSMC is extending beyond the 16-nanometer Titanium range and has already started work on the next generation of TSMC's high-performance 5-nanometer processes. In the near future, both companies believe that this new generation of products will lead the way in an era of change. Through these projects and the "easex" scheme, The Quantum core will be presented at 16 nanometers, 12 nanometers, or even 5 nanometers, with logical density ranging from 10K logical units to as many as 5M logical units.
 
"We are pleased to partner with Elensi to bring the Trion Titanium series to market using our industry-leading manufacturing technologies," said Mr. Lucas Tsai, TSMC's Business Management Director. We look forward to continuing our collaboration with Elenthink to build innovative high-density FPGA products using TSMC's advanced technology."

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