What tests are generally required for electronic components?

The detection of components is an indispensable basic work. How to accurately and effectively detect the relevant parameters of the components and judge whether the components are normal is not a uniform thing. Different methods must be adopted according to different components. , So as to determine whether the components are normal or not.

There are three main types of testing items for electronic components:

1. Routine testing

Mainly test the appearance, size, electrical performance and safety performance of electronic components; Test the basic parameters according to the specifications of the components, such as triode, to test the appearance, size, ICBO, VCEO, VCES, HFE, pin tension, pin bending, solderability, soldering heat resistance and other items. Some export products also Test RoHS.

2. Reliability test

Mainly test the life and environmental test of electronic components;
Test the life of the device and various environmental tests according to the requirements of the user and the specifications ；

3.DPA analysis

Mainly control the internal structure and process of the device.
Such as triode, the main methods include X-ray inspection of internal structure, sound scanning to monitor the internal structure and packaging process, unpacking to monitor the internal wafer structure and size, etc. Among them, X-Ray real-time imaging technology is increasingly widely used. Because of its non-destructive, fast, easy-to-use, and relatively low-cost characteristics, it is favored by more and more electronic product manufacturers. X-ray inspection can be used to check the internal state of components, such as chip layout, lead layout, lead frame design, solder balls (leads), etc. For components with complex structures, the angle, voltage, current, and image contrast and brightness of the X-ray tube can be adjusted to obtain effective image information.