Welcome to Chipmall.com
Products
View All Products
Home > News > News detail

Toshiba Launches Photorelays in New Package for High-density Mounting

TOSHIBA | 20/01/2021

TOKYO— Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched three photorelays, TLP3480, TLP3481 and TLP3482 in P-SON4, a new package with a significantly smaller mounting area than Toshiba’s SOP packages. Shipments start today.


All of the new photorelays have an OFF-state output terminal voltage rating and ON-state current rating comparable with products housed in SOP package products, with ratings ranging from 30V and 4.5A to 100V and 2A, according to the device.


The new P-SON4 package is highly suited to high-density mounting, as it has a mounting area of 7.2mm2 (typ.), approximately 74% smaller than the 2.54SOP4 package and 84% smaller than the 2.54SOP6 package. It also features low ON-resistance by using Toshiba’s latest MOSFET chips[1] in the receiver.


TLP3480, TLP3481, and TLP3482 have high ON-state-current ratings of 4.5A, 3A and 2A. They can be used in a wide range of measuring equipment applications.
buy Toshiba products
 

Applications
・Semiconductor testers (memory, SoC, LSI, etc.)
・Probe cards
・I/O interface boards


Features
・New small package P-SON4: 2.1 x 3.4mm (typ.), mounting area 7.2mm2 (typ.)
・Large ON-state current rating
 TLP3480: OFF-state output terminal voltage rating: 30V, ON-state current rating: 4.5A
 TLP3481: OFF-state output terminal voltage rating: 60V, ON-state current rating: 3A
 TLP3482: OFF-state output terminal voltage rating: 100V, ON-state current rating: 2A


Follow the link below for more on the new products.
https://toshiba.semicon-storage.com/ap-en/company/news/news-topics/2020/09/opto-20200914-1.html?utm_source=chip1stop&utm_medium=webmedia&utm_campaign=jp&cid=jp-chip1stop


*Company names, product names, and service names may be trademarks of their respective companies.
*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Tags
Topic
News Homepage
News detail

Brands

Cross News

1. Qi2 unified wireless charging standard announced a...

Qi2 unified wireless charging standard announced at CES

2. China successfully conducted air tests for the fir...

China successfully conducted air tests for the first unmanned transport aircraft

3. When will the chip shortage end?

When will the chip shortage end?

4. Why add a resistor between the gate and source of ...

Why add a resistor between the gate and source of the MOSFET? What is the function of this resistor?

5. I3C multiplexers and IO expanders deliver increase...

I3C multiplexers and IO expanders deliver increased flexibility in a small footprint

6. Rostec completed testing of the first prototype PD...

Rostec completed testing of the first prototype PD-8 engine

7. Another 44 billion rubles allocated for the creati...

Another 44 billion rubles allocated for the creation of Russian aircraft engines

8. Smallest and lowest power wireless connectivity so...

Smallest and lowest power wireless connectivity solutions for IoT designs

9. USB Type-C interface electrostatic protection scheme

USB Type-C interface electrostatic protection scheme

10. LTE and 5G communications

LTE and 5G communications

Connect with us
Email error
©2022 Chipmall.com Limited. All Rights Reserved.    Sitemap
We use cookies to offer you a better experience. Detailed information on the use of cookies on this website is provided in our Privacy Policy. By using this site, you consent to the use of our cookies.
Accept
Chat with the Chipmall Electronics Limited team