In the electronics industry, there are six common electronic components: resistors
, inductors, crystal diodes, transistors, and integrated circuits.
Resistors are commonly called resistors, and are the most commonly used electronic components in electronic equipment; capacitors are electronic components composed of two metal films close together and separated by insulating materials; inductance coils are insulated wires An electronic component made of a certain number of turns on an insulated skeleton; the main characteristic of a diode is unidirectional conductivity, that is, under the action of a forward voltage, the on-resistance is small; and it is turned on under the action of a reverse voltage Extremely large or infinite resistance; transistors have amplifying and switching functions in the circuit; integrated circuits are electronic components such as diodes, transistors, resistors and capacitors that are manufactured on a small piece of semiconductor material according to the requirements of the circuit structure to form a complete Circuits with certain functions are then packaged.
In addition to the performance and appearance of the six electronic components, the internal inspection cannot be ignored. The inspection of solder joints is a topic that the six electronic components must face.
Conventional solder joint inspection equipment is divided into AOI and X-ray, mainly X-ray inspection equipment. Because of its short wavelength and high energy, X-rays are only partly absorbed by the material when they are irradiated on the material, and most of them are transmitted through the inter-atomic gap, showing strong penetrating ability. The ability of X-rays to penetrate matter is related to the energy of X-ray photons. The shorter the wavelength of X-rays, the greater the energy of the photons and the stronger the penetrating power. The penetrating power of X-rays is also related to the density of a substance, and substances with different densities can be distinguished by the property of differential absorption.
Under X-ray, the inspection of electronic components also includes the inspection of BGA. Using X-rays, internal defects, bubbles, inclusions, slag inclusions, pores and other defects can be accurately detected.