Welcome to Chipmall.com
Products
View All Products
Home > News > News detail

NVM offers compatibility with MPU for high-speed processing of embedded AI imaging

electropages | Dialog Semiconductor | 17/08/2020

Dialog Semiconductor has announced that its EcoXiP octal xSPI NVM is now optimised to be utilised with Renesas’ RZ/A2M Arm-based MPUs. Customers of the RZ/A2M, which is intended for high-speed processing of embedded AI imaging in service robots, smart appliances, and industrial machinery, are able to take advantage of the system-level benefits of the NVM.

 

For systems leveraging the MPU, the device facilitates ultra-fast boot for instant-on capability and real-time system responsiveness. It also provides efficient storing of AI weights for low-power AI inference. Also, the device allows MPUs such as the RZ/A2M to run in XiP mode for code execution right from external flash memory.

DialogSemiconductor
 

“With RZ/A2M MPUs featuring Renesas’ exclusive Dynamically Reconfigurable Processor (DRP) technology, we bring real-time, low-power image processing to IoT endpoints,” said Shigeki Kato, vice president of Enterprise Infrastructure Business Division at Renesas. “We are delighted to welcome Dialog’s EcoXiP device to the ever-growing ecosystem around our MPUs. We look forward to working with Dialog in order to show how our MPUs and EcoXiP can benefit a growing number of applications, accelerating intelligence at the IoT edge.”

 

“Together with Renesas’ RZ/A2M, we are able to demonstrate multiple facets of EcoXiP’s performance and power consumption benefits,” said Gideon Intrater, CTO, of the Industrial Business at Dialog. “With its RZ/A2M, Renesas is addressing the need for more powerful processing and real-time operation to enable embedded AI imaging in IoT endpoints. As an external companion flash memory, EcoXiP provides a balanced tradeoff of performance and power advantages for a broad range of emerging IoT applications that can benefit from AI imaging.”

Tags
Topic
News Homepage
News detail

Brands

Cross News

1. NASA’s latest Mars Rover enabled by radiation-hard...

NASA’s latest Mars Rover enabled by radiation-hardened technology

2. Tantalum polymer capacitors set new performance be...

Tantalum polymer capacitors set new performance benchmarks in automotive and super computing

3. Power module for mid-power electric vehicle tracti...

Power module for mid-power electric vehicle traction inverters

4. AMD Achieves 25x Energy Efficiency Goal from 2014

AMD Achieves 25x Energy Efficiency Goal from 2014

5. Extended range of axial hybrid-polymer aluminium e...

Extended range of axial hybrid-polymer aluminium electrolytic capacitors

6. Power MOSFETs offer high power density and efficiency

Power MOSFETs offer high power density and efficiency

7. New rubidium oscillator greater stability than tra...

New rubidium oscillator greater stability than traditional OCXOs

8. Common mode chip inductors provide optimal noise s...

Common mode chip inductors provide optimal noise suppression solutions

9. Wireless charging coils in both single and multipl...

Wireless charging coils in both single and multiple windings

10. Wideband RF synthesiser attains low in-band noise ...

Wideband RF synthesiser attains low in-band noise and integrated jitter

Connect with us
Email error
©2022 Chipmall Electronics Limited. All Rights Reserved.    Sitemap
We use cookies to offer you a better experience. Detailed information on the use of cookies on this website is provided in our Privacy Policy. By using this site, you consent to the use of our cookies.
Accept